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? 2004-2013 microchip technology inc. ds21921c-page 1 mcp1612 features fixed switching frequency: 1.4 mhz input operating voltage range: 2.7v to 5.5v integrated buck and synchronous switches adjustable-output voltage range: 0.8v to 5.0v 100% duty cycle capable for low input voltage continuous output current capability: 1a shutdown control with i q < 0.01 a (typ.) integrated soft-start feature integrated undervoltage lockout (uvlo) protection integrated overtemperature protection fast dynamic response to line and load steps small, 8-pin dfn and msop packages operating temperature range: -40c to +85c applications network interface cards portable computers set-top boxes dsl modems and routers usb-powered devices gbic modules high-speed data system bus termination medical instruments cellular/gsm/phs phones +5v or +3.3v distributed voltages description the mcp1612 is a 1a, 1.4 mhz, fully-integrated, current mode-controlled, synchronous buck regulator. the mcp1612 is packaged in the 8-pin msop and space-saving, 3x3 dfn packages. the dfn package also provides a lower thermal resistance package option for high-power, high ambient temperature applications. with an input operating range from 2.7v to 5.5v, the mcp1612 is ideal for applications that are powered by one single-cell li-ion, 2- to 3-cell nimh, nicd or alkaline sources. the output voltage of the mcp1612 is easily set over the range of 0.8v to 5.0v by using an external resistor divider. the external inductor and output capacitor size are minimized due to an internally-fixed, 1.4 mhz clock being used to set the switching frequency. the fixed clock allows for continuous, fixed-frequency pwm operation over the full load range. the mcp1612 is designed to provide fast dynamic response to sudden changes in input voltage and load current to minimize the necessary amount of external output capacitance. the mcp1612 can be used with ceramic, tantalum or aluminum electrolytic output capacitors. ceramic capacitors with values as low as 4.7 f can be used to keep the output ripple voltage low. for applications that require better load step performance, the value of the output capacitor can be increased to 47 f. additional features integrated into the mcp1612 include shutdown capability, soft-start, uvlo, overcurrent and overtemperature protection. package types 8-lead dfn 1 2 3 4 8 7 6 5 v cc shdn comp v in p gnd l x a gnd fb 1 2 3 4 8 7 6 5 v cc shdn comp v in p gnd l x a gnd fb 8-lead msop single 1a, 1.4 mhz sync hronous buck regulator downloaded from: http:///
mcp1612 ds21921c-page 2 ? 2004-2013 microchip technology inc. functional block diagram ndrv pdrv inset circuit in gm i sense p-channel + + slope comp. v cc p gnd v cc a gnd a gnd a 1.2v 0.8v C + fb comp leading- edge blank soft- disable thermal shutdown shdn disable undervoltage lockout v cc v in l x a gnd p gnd 1.4 mhz clock uvlo uvlo disable peak current limit v ref peak current limit disable v ref start v bg (uvlo) downloaded from: http:///
? 2004-2013 microchip technology inc. ds21921c-page 3 mcp1612 typical application circuit mcp1612 3.3v to 1.2v synchronous buck converter c in 10 f ceramic v in fb a gnd p gnd l x 1 10 ? 2 c byp 0.1 f ceramic v cc shdn 3 3.3 v in 10% 4 off on 1000 pf 25 k ? comp l = 3.3 h 100 k ? 200 k ? 1.2v v out @ 1a 5 6 7 8 mcp1612 c out 10 f ceramic downloaded from: http:///
mcp1612 ds21921c-page 4 ? 2004-2013 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings ? v in C a gnd .......................................................................6.0v (shdn , fb, v cc , comp ........... (a gnd C 0.3v) to (v in + 0.3v) l x to p gnd .............................................. -0.3v to (v in + 0.3v) p gnd to a gnd ...................................................-0.3v to +0.3v output short circuit current ................................. cont inuous storage temperature .....................................-65c to +150c ambient temp. with power applied.................-40c to +85c operating junction temperature...................-40c to +125c esd protection on all pins (hbm) ??????????????????????????????????????? ? 4kv esd protection on all pins (mm) ?????????????????????????????????????????? 300v ? notice: stresses above those listed under maximum ratings may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this sp ecification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. dc characteristics electrical specifications: unless otherwise noted, v in = v cc = v shdn = 3.3v, v out = 1.8v, c in = c out = 10 f, l = 3.3 h, i load = 100 ma, t a = +25c. boldface specifications apply over the t a range of -40c to +85c. parameters sym min typ max units conditions input voltage input operating voltage v in 2.7 5.5 v input shutdown current i(v in ) 0.01 1 a shutdown mode (shdn = gnd) input quiescent current i(v in ) 5 7m a i load = 0 ma oscillator characteristics internal oscillator frequency f osc 1.2 1.4 1.6 mhz internal power swicthes r dson p-channel r dson-p 300 m ? i p = 250 ma r dson n-channel r dson-n 300 m ? i n = 250 ma l x pin leakage current i lx -1 1 a shdn = 0v, v in = 5.5v, l x = 0v, l x = 5.5v positive current limit threshold +i lx(max) 2 . 3 a negative current limit threshold -i lx(max) - 1 . 4 a feedback characteristics transconductance from fb to comp g m 35 62 90 a/v output voltage output voltage range v out 0.8 v in v reference feedback voltage v fb 0.78 0.8 0.82 v feedback input bias current i vfb 1n a line regulation v line-reg 0.15 0.5 %/v v in = 2.7v to 5.5v, i load = 100 ma load regulation v load-reg 0 . 2 5 %v in = 4.2v, i load = 100 ma to 1a note 1: the integrated mosfet switches have an integral diode from the l x pin to v in and from l x to p gnd . in cases where these diodes are forward-biased, the package power dissipat ion limits must be adhered to. thermal protection is not able to regulate the junction temperature for these cases. 2: uvlo is specified for a falling v in . once the uvlo is activated, the uvlo- hys must be overcome before the device will return to operation. downloaded from: http:///
? 2004-2013 microchip technology inc. ds21921c-page 5 mcp1612 temperature specifications protection features undervoltage lockout uvlo 2.4 2.55 2.7 v note 2 undervoltage lockout hysteresis uvlo- hys 200 mv thermal shutdown t shd 160 c note 1 thermal shutdown hysteresis t shd-hys 9 c interface signal (shdn ) logic-high input v in-high 45 % o f v in logic-low input v in-low 15 % of v in electrical specifications: v in = 3.0v to 5.5v, f osc = 1 mhz with 10% duty cycle, c in = 0.1 f. t a = -40c to +125c. parameters sym min typ max units conditions temperature ranges storage temperature range t a -65 +150 c continuous maximum junction temperature t j +150 c transient only operating junction temperature range t a - 40 + 125 c continuous operation thermal package resistances thermal resistance, 8l-msop ? ja 208 c/w typical 4-layer board interconnecting vias thermal resistance, 8l-dfn ? ja 41 c/w typical 4-layer board interconnecting vias dc characteristics (continued) electrical specifications: unless otherwise noted, v in = v cc = v shdn = 3.3v, v out = 1.8v, c in = c out = 10 f, l = 3.3 h, i load = 100 ma, t a = +25c. boldface specifications apply over the t a range of -40c to +85c. parameters sym min typ max units conditions note 1: the integrated mosfet switches have an integral diode from the l x pin to v in and from l x to p gnd . in cases where these diodes are forward-biased, the package power dissipati on limits must be adhered to. thermal protection is not able to regulate the junction temperature for these cases. 2: uvlo is specified for a falling v in . once the uvlo is activated, the uvlo- hys must be overcome before the device will return to operation. downloaded from: http:///
mcp1612 ds21921c-page 6 ? 2004-2013 microchip technology inc. 2.0 typical performance curves note: unless otherwise indicated, v in = v cc = v shdn = 3.3v, c out = c in = 10 f, l = 3.3 h, i load = 100 ma, t a =+25c. boldface specifications apply over the t a range of -40c to +85c. figure 2-1: efficiency vs. load current, v in = 3.3v. figure 2-2: efficiency vs. load current, v in = 5.0v. figure 2-3: output voltage vs. load current. figure 2-4: dropout voltage vs. load current. figure 2-5: input quiescent current vs. input voltage. figure 2-6: oscillator frequency vs. input voltage. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0 10 20 30 40 50 60 70 80 90 100 10 100 1000 load current (ma) efficiency (%) v in = 3.3v v out = 1.2v v out = 2.5v v out = 1.8v 0 10 20 30 40 50 60 70 80 90 100 10 100 1000 load current (ma) efficiency (%) v in = 5.0v v out = 3.3v v out = 2.5v -1.4 -1.2 -1 -0.8 -0.6 -0.4 -0.2 0 0 200 400 600 800 1000 load current (ma) change in output voltage (mv) v out = 3.3v, v in = 5.0v v out = 1.8v, v in = 3.3v v out = 1.2v v in = 3.3v 0.00 0.10 0.20 0.30 0.40 0.50 0 200 400 600 800 1000 load current (ma) dropout voltage (v) v out = 2.7v v out = 3.3v 3.5 4.0 4.5 5.0 5.5 6.0 6.5 2 . 533 . 544 . 555 . 5 input voltage (v) input quiescent current (ma) v out = 1.8v t a = -40 o c t a = +25 o c t a = +85 o c 1.36 1.37 1.38 1.39 1.40 1.41 1.42 2.5 3 3.5 4 4.5 5 5.5 input voltage (v) oscillator frequency (mhz) t a = -40 o c t a = +25 o c t a = +85 o c downloaded from: http:///
? 2004-2013 microchip technology inc. ds21921c-page 7 mcp1612 typical performance curves (continued) note: unless otherwise indicated, v in = v cc = v shdn = 3.3v, c out = c in = 10 f, l = 3.3 h, i load = 100 ma, t a =+25c. boldface specifications apply over the t a range of -40c to +85c. figure 2-7: power-up from v in . figure 2-8: power-up from shutdown. figure 2-9: load transient response. figure 2-10: load transient response. figure 2-11: line transient response. figure 2-12: line transient response. v in 2.0v/div v out 1.0v/div start-up from v in = 0v to 3.3v 1.0 ms/div v out = 1.8v shdn 2.0v/div v out 1.0v/div start-up from shdn 1.0 ms/div v out = 1.8v v out 200 mv/div i out 500 ma/div i out = 100 ma to 800 ma 50 s/div v out = 1.8v v out 100 mv/div i out 500 ma/div i out = 100 ma to 800 ma 500 s/div v in = 5.0v v out = 3.3v v in 2.0v/div v out 50 mv/div line step response, v in = 3.0v to 4.0v 200 s/div v out = 1.8v i out = 800 ma v in 2.0v/div v out 50 mv/div line step response, v in = 4.5v to 5.5v 200 s/div v out = 3.3v i out = 800 ma downloaded from: http:///
mcp1612 ds21921c-page 8 ? 2004-2013 microchip technology inc. typical performance curves (continued) note: unless otherwise indicated, v in = v cc = v shdn = 3.3v, c out = c in = 10 f, l = 3.3 h, i load = 100 ma, t a = +25c. boldface specifications apply over the t a range of -40c to +85c. figure 2-13: low load current switching waveform. figure 2-14: high load current switching waveform. l x 2.0v/div i ind 100 ma/div 500 ns/div v in = 3.3v v out 10 mv/div i out = 10 ma, v out = 1.8v l x 5.0v/div i ind 500 ma/div 500 ns/div v in = 3.3v v out 10 mv/div i out = 1a, v out = 1.8v downloaded from: http:///
? 2004-2013 microchip technology inc. ds21921c-page 9 mcp1612 3.0 mcp1612 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function table 3.1 input voltage pin (v in ) connect the input voltage source to v in . for normal operation, the voltage on v in should be between +2.7v and +5.5v. a 10 f bypass capacitor should be connected between v in and p gnd . 3.2 analog input voltage pin (v cc ) v cc provides bias for internal analog functions. this voltage is derived by filtering the v in supply. 3.3 shutdown input pin (shdn ) connect shdn to a logic-level input in order to turn the regulator on or off. a logic-high (>45% of v in ) will enable the regulator. a logic-low (<15% of v in ) will force the regulator into shutdown mode. when in shutdown, both the p-channel and n-channel switches are turned off. 3.4 compensation pin (comp) comp is the internal transconductance amplifier output pin. external compensation is connected to comp for control-loop stabilization. 3.5 feedback pin (fb) connect the output voltage of the buck converter through an external resistor divider to fb to regulate the output voltage. the nominal voltage compared to this input for pulse termination is 0.8v. 3.6 analog ground pin (a gnd ) tie all small-signal ground returns to a gnd . noise on a gnd can effect the sensitive internal analog measurements. 3.7 power ground pin (p gnd ) connect all large-signal ground returns to p gnd . these large-signal traces should have a small loop area and length to prevent coupling of switching noise to sensitive traces. 3.8 buck inductor output pin (l x ) connect l x directly to the buck inductor. this pin carries large signal-level currents; all connections should be made as short as possible. pin no. name function 1v in input voltage pin 2v cc analog input voltage pin 3 shdn shutdown control input pin 4 comp transconductance amplifier output pin 5 fb feedback input pin 6a gnd analog ground pin 7p gnd power ground pin 8l x buck inductor output pin downloaded from: http:///
mcp1612 ds21921c-page 10 ? 2004-2013 microchip technology inc. 4.0 detailed description 4.1 device overview the mcp1612 is a 1a synchronous buck converter switching at 1.4 mhz to minimize external component size and cost. while utilizing a fixed-frequency current mode architecture, the mcp1612 provides fast response to sudden load changes, as well as overcurrent protection in the event of a shorted load. the input voltage range is 2.7v to 5.5v, while the output voltage is adjustable by properly setting an external resistor divider and can range from 0.8v to v in . integrated soft-start, uvlo and overtemperature protection minimize external circuitry and component count. 4.2 current mode control scheme the mcp1612 incorporates a peak current mode control scheme. peak current mode is used to obtain high gain in the pwm control loop for very fast response to dynamic line and load conditions. with both the p-channel and n-channel mosfets turned off, the beginning of a cycle occurs on the negative edge of the internal 1.4 mhz oscillator, the p-channel mosfet turns on and current ramps up into the buck inductor. the inductor current is sensed and tied to one input of a high-speed comparator. the other input of the high-speed comparator is the error amplifier output. this is the amplified difference between the internal 0.8v reference and the divided-down v out signal at the fb pin of the mcp1612. when the sensed inductor current ramps up to the point that is equal to the amplified error signal, the high-speed comparator output switches states and the p-channel mosfet is turned off until the beginning of the next clock cycle and the n-channel is turned on. the width of the pulse (or duty cycle) is ideally determined by the v out /v in ratio of the dc/dc converter. the actual duty cycle is slightly larger to account for the non-ideal losses of the integrated mosfet switches and the losses in the external inductor. 4.3 low-dropout operation the mcp1612 is capable of operating over a wide range of input voltages. the pwm architecture allows for the p-channel mosfet to achieve 100% duty cycle operation for applications that have minimal input volt- age headroom. during 100% duty cycle mode, the output voltage (v out ) is equal to the output current (i out ) x resistance (p-channel r dson + r inductor ). 4.4 current limit cycle-by-cycle current limit is used to protect the mcp1612 from being damaged when an external short circuit is applied. the typical peak current limit is 2.3a. if the sensed inductor current reaches the 2.3a limit, the p-channel mosfet is turned off, even if the output voltage is not in regulation. 4.5 soft-start during normal power-up, as v in rises above the uvlo protection setting (or, in the case of a logic-low to logic- high transition on the shutdown pin), the rise time of the mcp1612 output voltage is controlled by the soft-start feature. this is accomplished by allowing the output of the error amplifier to slowly rise. this feature prevents the output voltage from overshooting the desired value and the sudden inrush of current, depleting the input capacitors and causing a large dip in input voltage. this large dip in the input voltage can trip the uvlo thresh- old, causing the converter to shut down prior to reach- ing steady-state operation. 4.6 undervoltage lockout (uvlo) the uvlo feature uses a comparator to sense the input voltage level (v in ). if the input voltage is lower than the voltage necessary to properly operate the mcp1612, the uvlo feature will hold the converter off. when v in rises above the necessary input voltage, the uvlo is released and soft-start begins. for the mcp1612, the uvlo protection threshold is at a maximum of 2.7v. hysteresis is built into the uvlo circuit to compensate for input impedance. for example, if there is any resistance between the input voltage source and the converter (once it starts), there will be a voltage drop at the converter input equal to i in x r in . the typical hysteresis for the mcp1612 is 200 mv. 4.7 overtemperature protection the mcp1612 has an integrated overtemperature protection circuit that monitors the device junction temperature and shuts the device off if the junction temperature exceeds the typical 160c threshold. if the overtemperature threshold is reached, the soft-start is reset so that, when the junction temperature cools to approximately 151c, the device will automatically restart and the output voltage will not overshoot. 4.8 shutdown input operation the shdn pin is used to turn the mcp1612 on and off. when the shdn pin is tied low, the mcp1612 is off. when tied high, the mcp1612 will be enabled and begin operation as long as the input voltage is not below the uvlo threshold. downloaded from: http:///
? 2004-2013 microchip technology inc. ds21921c-page 11 mcp1612 5.0 application circuits/information figure 5-1: typical application circuit. 5.1 typical applications the mcp1612 buck controller can be used in several different applications where a voltage that is lower than the supply voltage is required. its small size, low cost and high efficiency make the mcp1612 a good choice for densely-packaged applications. the input voltage range, low-dropout voltage and low shutdown current make this part perfectly suited for battery-powered applications. 5.2 design example the step-by-step design of a buck converter with the following parameters is presented to illustrate how easy the mcp1612 is to use. 5.2.1 setting output voltage the output voltage of the mcp1612 is set by using an external resistor-divider network. the voltage present at fb is internally compared to a 0.8v reference voltage. a 200 k ?? resistor is recommended for r 2 , the lower-end of the voltage divider. using higher-value resistors will make the circuit more susceptible to noise on the fb pin. lower-value resistors can be used, if necessary. equation 5-1, used to calculate the output voltage, is shown below. equation 5-1: for this example: the mcp1612 is capable of a 15% duty cycle. instability may result when the duty cycle is below 15%. if less than 15% duty cycle operation is needed, care must be taken to ensure stable operation. mcp1612 3.3v to 1.2v synchronous buck converter c in 10 f ceramic v in fb a gnd p gnd l x 1 10 ? 2 c byp 0.1 f ceramic v cc shdn 3 3.3v in 10% 4 off on 1000 pf 25 k ? comp l = 3.3 h 100 k ? 200 k ? 1.2v v out @ 1a 5 6 7 8 mcp1612 c out 10 f ceramic input voltage = 3.3v output voltage = 1.2v output current = 0a to 1a switching frequency = 1.4 mhz v out =1.2v v fb =0.8v r 2 =200k ? r 1 =100k ? r 1 r 2 v out v fb ------------- 1 ? ?? ?? ? = where: v out = desired output voltage v fb = mcp1612 internal reference voltage r 1 = top resistor value r 2 = bottom resistor value downloaded from: http:///
mcp1612 ds21921c-page 12 ? 2004-2013 microchip technology inc. 5.2.2 buck inductor there are many requirements that need to be satisfied when selecting the buck inductor. the application, physical size, current rating, resistance, mounting method, supplier, temperature range, minimum inductance and cost all need to be considered. many suppliers specify the maximum peak current that an inductor can handle before magnetic saturation occurs. the peak current is equal to the maximum dc output current, plus one-half the peak-to-peak ac ripple current. when the p-channel mosfet is on, the current in the buck inductor is ramped up. the voltage across the inductor, the inductance and the mosfet on-time are required to determine the peak-to-peak ripple current. when operating in continuous current mode, the on- time of the p-channel mosfet is determined by multiplying the duty cycle by the switching period. the following equation can be used to determine the duty cycle. equation 5-2: the on-time is then defined as follows. equation 5-3: the ac ripple current in the inductor can be calculated by the following relationship. equation 5-4: solving for ? i l yields: equation 5-5: the value of the buck inductor is chosen to be 3.3 h. the ac ripple current is controlled by the size of the buck inductor. the value of the inductor will therefore need to be raised so that the converter operates in continuous conduction mode. calculation of the buck inductor current rating follows. the inductor selected must have an inductance of 3.3 h at a peak current rating of 1.08a. the dc resis- tance of the inductor should be as low as is feasibly possible. extremely low dc resistance inductors are available, though a trade-off between size and cost should be considered. 5.2.3 output capacitor the output capacitor is used to filter the inductor ac ripple current and provide storage for load transients. the size and equivalent series resistance (esr) of the output capacitor determines the amount of ripple voltage present at the output of the converter. when selecting the output capacitor, a design trade-off has to be made between the acceptable ripple voltage and the size/cost of the output capacitor. ceramic capacitors have very low esr, but increase in cost with higher values. tantalum and electrolytic capacitors are relatively inexpensive in higher values, but they also have a much higher esr. the amount of capacitance needed to obtain the desired ripple voltage is calculated by using the following relationship. equation 5-6: dutycycle v out v in ------------- = t on dutycycle 1 f sw --------- - ? = where: f sw = switching frequency v l l ? i l ? t -------- ? = ? i l v l l ----- - ? t ? = where: v l = voltage across the inductor (v in C v out ) ? t = on-time of the p-channel mosfet v in =3.3v v out =1.2v f sw =1.4mhz i out(max) =1a t on = (1.2v/3.3v) x (1/1.4 mhz) t on = 260 ns v l = (3.3v C 1.2v) = 2.1v ? i l = (2.1v/3.3 h) x 260 ns ? i l =165ma i l(peak) =i out(max) + 1/2 ? i l i l(peak) = 1a + (165 ma)/2 i l(peak) =1.08a i c c ? v c ? t ---------- - ? = downloaded from: http:///
? 2004-2013 microchip technology inc. ds21921c-page 13 mcp1612 solving for c: there will also be some ripple voltage caused by the esr of the capacitor. the ripple is defined as follows. equation 5-7: for this example: 5.2.4 input capacitor for the buck topology, the input current is pulled from the source and the input capacitor in pulses. the size of the input capacitor will determine the amount of current pulled from the source. for most applications, a 10 f ceramic capacitor connected between the mcp1612s v in and p gnd is recommended to filter the current pulses. less capacitance can be used for applications that have low source impedance. the ripple current rating for ceramic capacitors are typically very high due to their low loss characteristics. low-cost electrolytic capacitors can be used, but their ripple current rating should not be exceeded. 5.2.5 v cc input the v cc input is used to bias the internal mcp1612 circuitry. a 10 ? resistor is recommended between the unregulated inputs v in and v cc , along with a 0.1 f capacitor to ground to help isolate the v cc pin from the switching noise. 5.2.6 compensation components an internal transconductance error amplifier is used to compensate the buck converter. an external resistor (r c ) and capacitor (c c ), connected between comp and gnd, are all that is needed to provide a high- bandwidth loop. table 5-1 identifies values for r c and c c for standard buck inductor (l) and output capacitor (c out ) values. 5.3 printed circuit board (pcb) layout the mcp1612 is capable of switching over 1a at 1.4 mhz. as with all high-frequency switching power supplies, good pcb layout techniques are essential to prevent noise generated by the switching power-train from interfering with the sensing circuitry. there are two ground pins (p gnd and a gnd ) on the mcp1612 to separate the large-signal ground current from the small-signal circuit ground. these two grounds should be kept separate, only connecting near the input bulk capacitor. care must also be taken to minimize the length and loop area of the large signal connections. components connected to this loop consist of the input bulk capacitor, v in , p gnd and l x pins of the mcp1612, the buck inductor and the output filter capacitor. i c = 165 ma c=4.7f ? t = 260 ns esr = 8 m ? ? v c = (260 ns x 165 ma)/4.7 f ? v c =9.13mv v esrripple =8m ? x 165 ma v esrripple =1.32mv ? v out = ? v c + v esrripple ? v out =9.13mv + 1.32mv ? v out = 10.45 mv ci c ? t ? v c ---------- - ? = where: i c = peak-to-peak ripple current ? t = on-time of p-channel mosfet ? v c = output ripple voltage v esrripple esr i c ? = table 5-1: r c and c c values lc out r c c c 3.3 h 10.0 f 25 k ? 1000 pf 2.2 h 4.7 f 10 k ? 1000 pf downloaded from: http:///
mcp1612 ds21921c-page 14 ? 2004-2013 microchip technology inc. 6.0 packaging information 6.1 package marking information 8-lead msop example: xxxxx ywwnnn 1612 i 532256 8-lead dfn (3mm x 3mm) example: xxxx yyww nnn 1612 i0532 256 legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week 01) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e downloaded from: http:///
? 2004-2013 microchip technology inc. ds21921c-page 15 mcp1612 8-lead plastic dual-flat, no-lead package (mf) 3x3x0.9 mm body (dfn) ? saw singulated d2 e a1 a a3 top view exposed metal pad bottom view 2 1 id index pin 1 d l e2 p b n area (note 1) tie bar (note 3) exposed alternate exposed pad configurations (note 2) exposed pad varies according to die attach paddle size. bsc: basic dimension. theoretically exact value shown without tolerances. ref: reference dimension, usually without tolerance, for information purposes only. nom inches .026 bsc .118 bsc .008 ref. .118 bsc package may have one or more exposed tie bars at ends. pin 1 visual index feature may vary, but must be located within the hatched area. jedec equivalent: m0-229 see asme y14.5m see asme y14.5m * controlling parameter revised 07-20-05 exposed pad width number of pins contact thickness overall length overall height exposed pad length contact length contact width overall width notes: standoff pitch units dimension limits d2 l b e2 d a1 a3 e a p .043 .059 .008 .009 .000 .031 min n millimeters * .061 .092 .016 .012 .001 .035 .063 .096 .020 .015 .002 .039 8 max 3.00 bsc 0.20 ref. 0.65 bsc 3.00 bsc 1.09 0.20 0.23 1.50 0.80 0.00 1.55 0.40 0.30 2.37 0.02 0.90 min nom 8 2.45 0.50 0.37 1.60 0.05 1.00 max 1.2. 3. drawing no. c04-062 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
mcp1612 ds21921c-page 16 ? 2004-2013 microchip technology inc. 8-lead plastic micro small outline package (ms) (msop) d a a1 l c ? a2 e1 e p b n1 2 ? ? f dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exc eed .010" (0.254mm) per s ide. .037 ref f footprint (reference) notes: revised 07-21-05 * controlling parameter mold draft angle top mold draft angle bottom foot angle lead width lead thickness ? ? c b ? .003 .009 .006 .012 dimension limits overall height molded package thickness molded package width overall length foot length standoff overall width number of pins pitch a l e1 d a1 e a2 .016 .024 .118 bsc .118 bsc .000 .030 .193 bsc .033 min p n units .026 bsc nom 8 inches 0.95 ref -- .009 .016 0.08 0.22 0 0.23 0.40 8 millimeters * 0.65 bsc 0.85 3.00 bsc 3.00 bsc 0.60 4.90 bsc .043 .031 .037 .006 0.40 0.00 0.75 min max nom 1.10 0.80 0.15 0.95 max 8 - -- 15 5 - 15 5 - jedec equivalent: mo-187 0 - 8 5 5 - - 15 15 - - -- bsc: basic dimension. theoretically exact value shown without tolerances. ref: reference dimension, usually without tolerance, for information purposes only. see asme y14.5m see asme y14.5m drawing no. c04-111 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2004-2013 microchip technology inc. ds21921c-page 17 mcp1612 appendix a: revision history revision c (january 2013) added a note to each package outline drawing. revision b (september 2005) the following is the list of modifications: 1. changed pin 6 in package types diagram on front page. 2. removed device qualification note in package marking section. 3. removed device qualification note in package outline drawing. 4. removed device qualification note in package identification system section 5. replaced msop and qfn package diagrams. revision a (december 2004) original release of this document. downloaded from: http:///
mcp1612 ds21921c-page 18 ? 2004-2013 microchip technology inc. notes: downloaded from: http:///
? 2004-2013 microchip technology inc. ds21921c-page 19 mcp1612 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . device: mcp1612: synchronous buck regulator mcp1612t: synchronous buck regulator (tape and reel) temperature range: i = -40c to +85c package: mf = dual flat, no lead (3x3mm body), 8-lead ms = plastic msop, 8-lead part no. x /xx package temperature range device examples: a) mcp1612-adji/ms: industrial temperature, 8ld msop package. b) mcp1612t-adji/ms: tape and reel industrial temperature, 8ld msop package. c) mcp1612-adji/mf: industrial temperature, 8ld dfn package. d) mcp1612t-adji/mf: tape and reel industrial temperature, 8ld dfn package. downloaded from: http:///
mcp1612 ds21921c-page 20 ? 2004-2013 microchip technology inc. notes: downloaded from: http:///
? 2004-2013 microchip technology inc. ds21921c-page 21 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, app lication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2004-2013, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 9781620769164 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchips code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory an d analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 == downloaded from: http:///
ds21921c-page 22 ? 2004-2013 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - hangzhou tel: 86-571-2819-3187 fax: 86-571-2819-3189 china - hong kong sar tel: 852-2943-5100 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8864-2200 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - osaka tel: 81-6-6152-7160 fax: 81-6-6152-9310 japan - tokyo tel: 81-3-6880- 3770 fax: 81-3-6880-3771 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-213-7828 fax: 886-7-330-9305 taiwan - taipei tel: 886-2-2508-8600 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 worldwide sales and service 11/29/12 downloaded from: http:///

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